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  4546h-rke-03/14 features integrated pll loop filter esd protection also at ant1/ant2 (3kv hbm/150v mm; except pin 2: 3kv hbm/100v mm) high output power (5.5dbm) with low supply current (8.5ma) modulation scheme ask/fsk fsk modulation is achieved by connecting an additional capacitor between the xtal load capacitor and the open drain output of the modulating microcontroller easy to design-in due to excellent isolation of the pll from the pa and power supply single li-cell for power supply supply voltage 2.0v to 4.0v in the temperature range of ?40c to +85c/+125c package tssop8l single-ended antenna output with high efficient power amplifier clk output for clocking the microcontroller one-chip solution with minimum external circuitry 125c operation for tire pressure systems t5750c uhf ask/fsk transmitter datasheet
t5750c [datasheet] 4546h?rke?03/14 2 1. description the atmel ? t5750c is a pll transmitter ic which has been dev eloped for the demands of rf low-cost transmission systems at data rates up to 32kbaud. the transmitting frequency range is 868 mhz to 928 mhz. it can be used in both fsk and ask systems. figure 1-1. system block diagram micro- controller pll uhf ask/fsk remote control receiver uhf ask/fsk remote control transmitter t5750c t5760/ t5761 lna vco pll xto lna vco antenna demod if amp control 1 to 3 encoder atarx9x xto 1 li cell keys antenna
3 t5750c [datasheet] 4546h?rke?03/14 2. pin configuration figure 2-1. pinning tssop8l table 2-1. pin description pin symbol function configuration 1 clk clock output signal for micro con roller the clock output frequency is set by the crystal to f xtal /4 2 pa_enable switches on power amplifier, used for ask modulation 3 4 ant2 ant1 emitter of antenna output stage open collector antenna output enable 3 4 2 1 vs gnd t5750c xtal clk pa_enable 8 7 6 5 ant2 ant1 100 100 clk vs 20a u ref = 1.1v pa_enable 50k ant1 ant2
t5750c [datasheet] 4546h?rke?03/14 4 figure 2-2. block diagram 5 xtal connection for crystal 6 vs supply voltage see esd protection circuitry (see figure 4-5 on page 8 ) 7 gnd ground see esd protection circuitry (see figure 4-5 on page 8 ) 8 enable enable input table 2-1. pin description (continued) pin symbol function configuration 1.5k 1.2k 182a xtal vs vs 200k enable t5750c cp power up/down pdf 64 5 6 7 8 4 3 2 xtal vs gnd enable ant1 ant2 pa_enable clk 1 f lf pa vco pll xto 4 f
5 t5750c [datasheet] 4546h?rke?03/14 3. general description this fully integrated pll transmitter allows particularly simple , low-cost rf miniature transm itters to be assembled. the vco is locked to 64 f xtal hence a 13.5672mhz crystal is needed for a 868. 3mhz transmitter and a 14.2969mhz crystal for a 915mhz transmitter. all other pll and vc o peripheral elements are integrated. the xto is a series resonance oscillator so that only one capa citor together with a crystal c onnected in series to gnd are needed as external elements. the crystal oscillator together with the pll needs typically < 1ms until the pll is locked and the clk output is stable. there is a wait time of 4ms must be used until the clk is used for t he microcontroller and the pa is switched on. the power amplifier is an open-collector output delivering a current pulse which is near ly independent from the load impedance. the delivered output power is henc e controllable via the connected load impedance. this output configuration enables a simple matching to any kind of antenna or to 50 . a high power efficiency of =p out /(i s,pa v s ) of 24% for the power amplifier at 868.3 mhz results when an optimized load impedance of z load = (166 + j226) is used at 3v supply voltage. 4. functional description if enable = l and the pa_enable = l, the circuit is in standby mo de consuming only a very small amount of current, so that a lithium cell used as power supply can work for several years. with enable = h the xto, pll and the clk driver are switched on. if pa_enable remains l only the pll and the xto is running and the clk signal is delivered to the microc ontroller. the vco locks to 64 times the xto frequency. with enable = h and pa_enable = h the pll, xto, clk driver and the power amplifier are on. with pa_enable the power amplifier can be switch ed on and off, which is used to perform the ask modulation. 4.1 ask transmission the atmel ? t5750c is activated by enable = h. pa_enable must remain l for t 4ms, then the clk signal can be taken to clock the microcontroller and the output power can be modulated by mean s of pin pa_enable. after transmission pa_enable is switched to l and the microcontroller switches ba ck to internal clocking. the atmel t5750c is switched back to standby mode with enable = l. 4.2 fsk transmission the atmel t5750c is activated by enable = h. pa_enable must remain l for t 4ms, then the clk signal can be taken to clock the microcontroller and the power amplifier is swit ched on with pa_enable = h. the chip is then ready for fsk modulation. the microcontroller starts to switch on and off the capacitor between the xtal load capacitor and gnd with an open-drain output port, thus c hanging the reference frequency of the pll. if t he switch is closed, the output frequency is lower than if the switch is open. after transmission pa_enabl e is switched to l and the micr ocontroller switches back to internal clocking. the atmel t5750c is switched back to standby mode with enable = l. the accuracy of the frequency deviation with xtal pulling method is about 25% when the following tolerances are considered. figure 4-1. tolerances of frequency modulation using c 4 =9.2pf2%, c 5 = 6.8pf 5%, a switch port with c switch = 3pf 10%, stray capacitances on each side of the crystal of c stray1 =c stray2 = 1pf 10%, a parallel capacit ance of the crystal of c 0 = 3.2pf 10% and a crystal with c m = 13ff 10%, an fsk deviation of 21.5khz typical with worst case tolerances of 16.8khz to 28.0khz results. r s l m c 4 c m v s xtal crystal equivalent circuit c 0 c 5 c switch c stray1 c stray2
t5750c [datasheet] 4546h?rke?03/14 6 4.3 clk output an output clk signal is provided for a connected microcontroll er, the delivered signal is cmos compatible if the load capacitance is lower than 10pf. 4.3.1 clock pulse take-over the clock of the crystal oscillator can be used for clocking the microcontroller. atmel ? ?s atarx9x has the special feature of starting with an integrated rc-oscillator to switch on t he t5750c with enable = h, and after 4 ms to assume the clock signal of the transmission ic, so that the message can be sent with crystal accuracy. 4.3.2 output matching and power setting the output power is set by the load impedance of the antenna. the maximum out put power is achieved with a load impedance of z load,opt =(166+j226) at 868.3mhz. there must be a low resistive path to v s to deliver the dc current. the delivered current pulse of the power am plifier is 7.7ma and the maxi mum output power is deliver ed to a resistive load of 475 if the 0.53pf output capacitance of the power amplifier is compensated by the load impedance. an optimum load impedance of: z load = 475 || j/(2 p f 0.53pf) = (166 + j226) thus results for the maximum output power of 5.5dbm. the load impedance is defined as the impedance seen from the atmel t5750c?s ant1, ant2 into the matching network. do not confuse this large signal load impedance with a small sig nal input impedance delivered as input characteristic of rf amplifiers and measured from the applicat ion into the ic instead of fr om the ic into the application for a power amplifier. less output power is achieved by lowering the real parallel part of 475 where the parallel imaginary part should be kept constant. output power measurement can be done with the circuit of figure 4-2 on page 6 . note that the component values must be changed to compensate the individual board parasitics until the atmel t5750c ha s the right load impedance z load,opt =(166+j226) at 868.3mhz. also the damping of the cable us ed to measure the output power must be calibrated out. figure 4-2. output power measurement 4.4 application circuit for the supply-voltage blocking capacitor c 3 a value of 68nf/x7r is recommended (see figure 4-3 on page 7 and figure 4- 4 on page 8 ). c 1 and c 2 are used to match the loop antenna to the power amplifier where c 1 typically is 3.9pf/np0 and c 2 is 1pf/np0; for c 2 two capacitors in series should be used to achieve a better tolerance value and to have the possibility to realize the z load,opt by using standard valued capacitors. c 1 forms together with the pins of atmel t5750c and the pcb board wires a series resonance loop that suppresses the 1 st harmonic, hence the position of c 1 on the pcb is important. normally the best suppression is achieved when c 1 is placed as close as possible to the pins ant1 and ant2. the loop antenna should not exceed a width of 1.5mm, otherwise the q-factor of the loop antenna is too high. l 1 ( 50nh to 100nh) can be printed on pcb. c 4 should be selected so that the xto runs on the load resonance frequency of the crystal. normally, a value of 12pf results for a 15pf load-capacitance crystal. 1nf 1.5pf 2.7pf 10nh c 1 c 2 c 3 l 1 v s r in ant2 ant1 z lopt power meter 50 z = 50
7 t5750c [datasheet] 4546h?rke?03/14 figure 4-3. ask application circuit atarx9x t5750c cp power up/down pdf 64 5 6 7 1 vdd bpxy 20 vss vs 8 4 3 2 xtal xtal vs vs vs gnd enable ant1 l1 c1 c4 c3 loop antenna c2 ant2 pa_enable osc1 bpxy bpxy bpxy s1 s2 7 clk 1 f lf pa vco pll xto 4 f
t5750c [datasheet] 4546h?rke?03/14 8 figure 4-4. fsk application circuit figure 4-5. esd protection circuit atarx9x t5750c cp power up/down pdf 64 5 6 7 1 vdd bpxy 20 vss vs 8 4 3 2 xtal xtal vs vs vs gnd enable ant1 l1 c1 c5 c4 c3 loop antenna c2 ant2 pa_enable osc1 bpxy bpxy bpxy s1 s2 7 clk 1 f lf pa vco pll xto 4 f 18 bp42/t2o clk vs gnd pa_enable xtal ant2 enable ant1
9 t5750c [datasheet] 4546h?rke?03/14 5. absolute maximum ratings stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond t hose indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability . parameters symbol minimum maximum unit supply voltage v s 5 v power dissipation p tot 100 mw junction temperature t j 150 c storage temperature t stg ?55 125 c ambient temperature t amb ?55 125 c input voltage v maxpa_enable ?0.3 (v s + 0.3) (1) v note: 1. if v s + 0.3 is higher than 3.7v, the maximum voltage will be reduced to 3.7v. 6. thermal resistance parameters symbol value unit junction ambient r thja 170 k/w 7. electrical characteristics v s = 2.0v to 4.0v, t amb = ?40c to 125c unless otherwise specified. typical values are given at v s = 3.0v and t amb = 25c. all parameters are referred to gnd (pin 7). parameters test conditions symbol min. typ. max. unit supply current power down, v enable < 0.25v, ?40c to 85c v pa_enable < 0.25v, ?85c to +125c v pa_enable < 0.25v, 25c (100% correlation tested) i s_off <10 350 7 na a na supply current power up, pa off, v s = 3v, v enable >1.7v, v pa_enable < 0.25v i s 3.6 4.6 ma power up, v s = 3.0, v enable >1.7v, v pa_enable >1.7v i s_transmit 8.5 11 ma output power v s = 3.0v, t amb =25c, f = 868.3 mhz, z load = (166 + j226) p ref 3.5 5.5 8 dbm output power variation for the full temperature range t amb = ?40c to +85c, v s = 3.0v v s = 2.0v p ref p ref ?1.5 ?4.0 db db output power variation for the full temperature range t amb = ?40c to +125c, v s = 3.0v v s = 2.0v, p out = p ref + p ref p ref p ref ?2.0 ?4.5 db db achievable output-power range selectable by load impedance p out_typ ?3 +5.5 dbm spurious emission f clk = f 0 /128 load capacitance at pin clk = 10pf f o 1 f clk f o 4 f clk other spurious are lower ?52 ?52 dbc dbc note: 1. if v s is higher than 3.6v, the maximum voltage will be reduced to 3.6v.
t5750c [datasheet] 4546h?rke?03/14 10 oscillator frequency xto (= phase comparator frequency) f xto = f 0 /64 f xtal = resonant frequency of the xtal, c m 10ff, load capacitance selected accordingly t amb = ?40c to +85c, t amb = ?40c to +125c f xto ?30 ?40 f xtal +30 +40 ppm ppm pll loop bandwidth 250 khz phase noise of phase comparator referred to f pc = f xt0, 25khz distance to carrier ?116 ?110 dbc/hz in loop phase noise pll 25khz distance to carrier ?80 ?74 dbc/hz phase noise vco at 1mhz at 36mhz ?89 ?120 ?86 ?117 dbc/hz dbc/hz frequency range of vco f vco 868 928 mhz clock output frequency (cmos microcontroller compatible) f 0 /256 mhz voltage swing at pin clk c load 10pf v 0h v 0l v s 0.8 v s 0.2 v v series resonance r of the crystal rs 110 capacitive load at pin xt0 7 pf fsk modulation frequency rate duty cycle of the modulation signal = 50% 0 32 khz ask modulation frequency rate duty cycle of the modulation signal = 50% 0 32 khz enable input low level input voltage high level input voltage input current high v il v ih i in 1.7 0.25 20 v v a pa_enable input low level input voltage high level input voltage input current high v il v ih i in 1.7 0.25 v s (1) 5 v v a 7. electrical characteristics (continued) v s = 2.0v to 4.0v, t amb = ?40c to 125c unless otherwise specified. typical values are given at v s = 3.0v and t amb = 25c. all parameters are referred to gnd (pin 7). parameters test conditions symbol min. typ. max. unit note: 1. if v s is higher than 3.6v, the maximum voltage will be reduced to 3.6v.
11 t5750c [datasheet] 4546h?rke?03/14 9. package information 8. ordering information extended type number package remarks t5750c-6aqj tssop8l taped and reeled, marking: 570c, pb-free package drawing contact: packagedrawings@atmel.com gpc drawing no. rev. title 6.543-5083.01-4 2 03/15/04 package: tssop 8l 3 0.1 0.85 0.05 0.1 0.05 specifications according to din technical drawings 14 85 dimensions in mm 0.65 nom. 3 x 0.65 = 1.95 nom. 0.31 -0.07 +0.06 0.15 -0.02 +0.05 1 -0.15 +0.05 3.8 0.3 4.9 0.1 3 0.1
t5750c [datasheet] 4546h?rke?03/14 12 10. revision history please note that the following page numbers re ferred to in this section re fer to the specific revision mentioned, not to this document. revision no. history 4546h-rke-03/14 ? t5750 in t5750c on all pages substituted ? section 8 ?ordering information? on page 11 updated 4546g-rke-01/13 ? features on page 1 updated ? section 8 ?ordering information? on page 11 updated 4546f-rke-12/08 ? put datasheet in the newest template ? section 7 ?electrical characteristics? on page 10 updated 4546e-rke-02/07 ? put datasheet in the newest template ? pb-free logo on page 1 deleted 4546d-rke-09/05 ? pb-free logo on page 1 added ? ordering information on page 11 changed 4546c-rke-05/05 ? put datasheet in the newest template ? rename m4xcx9x in atarx9x ? table ?absolute maximum ratings? on page 9: new heading rows added 4546b-rke-07/04 ? table ?absolute maximum ratings? on page 9: row ?input voltage? added ? table ?absolute maximum ratings? on page 9: table note 1 added ? table ?electrical characteristics? on pages 9 to 10: row ?pa_enable input? updated ? table ?electrical characteristics? on pages 9 to 10: table note 1 added ? table ?ordering informations? on page 11: remarks updated
x x xx x x atmel corporation 1600 technology drive, san jose, ca 95110 usa t: (+1)(408) 441.0311 f: (+1)(408) 436.4200 | www.atmel.com ? 2014 atmel corporation. / rev.: rev.: 4546h?rke?03/14 atmel ? , atmel logo and combinations thereof, and others are registered tr ademarks or trademarks of atmel corporation or its subsidiar ies. other terms and product names may be trademarks of others. disclaimer: the information in this document is provided in c onnection with atmel products. no license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of atmel products. except as set forth in the atmel terms and condit ions of sales located on the atmel website, atmel assumes no liability wh atsoever and disclaims any express, implied or statutory warranty relating to its p roducts including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or non-infringement. in no event shall atmel be liable for any direct, indirect, consequential, pu nitive, special or incidental damages (including, without limi tation, damages for loss and profits, business interruption, or loss of information ) arising out of the use or inability to use this document, even if atmel has been advised of the possibility of such damages. atmel makes no r epresentations or warranties with respect to the accuracy or c ompleteness of the contents of this document and reserves the right to make changes to specificatio ns and products descriptions at any time without notice. atmel d oes not make any commitment to update the information contained herein. unless specifically provided otherwise, atme l products are not suitable for, and shall not be used in, automo tive applications. atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. safety-critical, military, and automotive applications disclaim er: atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to re sult in significant personal inju ry or death (?safety-critical a pplications?) without an atmel officer's specific written consent. safety-critical applications incl ude, without limitation, life support devices and systems, equipment or systems for t he operation of nuclear facilities and weapons systems. atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by atmel as military-grade. atmel products are not designed nor intended for use in automot ive applications unless spec ifically designated by atmel as automotive-grade.


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